Electronic circuit construction method, as for a wireless RF tag

ABSTRACT

A method for making an electronic circuit arrangement comprises providing a substrate having an electrical conductor thereon, wherein the electrical conductor includes two contacts spaced apart substantially a predetermined distance; providing an electronic jumper having two contacts spaced apart substantially the predetermined distance; mounting an electronic device on the electronic circuit jumper and having two contacts respectively connected to the two contacts of the electronic circuit jumper and then mounting the electronic circuit jumper on the substrate.

This application is a division of U.S. patent application Ser. No.10/191,580 filed Jul. 9, 2002, now U.S. Pat. No. 6,665,193 issued Dec.16, 2003.

The present invention relates to a method for making an electronicarticle.

Electronic identification and tracking of articles, persons,transactions and the like is becoming more prevalent, and theidentification devices that include an electronic device utilized forsuch identification and tracking are variously referred to as smarttags, smart cards, RF tags, RFID tags, wireless cards, wireless tags,contact cards and tags, and the like. Identification devices for certainutilizations such as credit cards, debit cards, cash cards, driver'slicenses, are of controlled size and often are relatively rigid and/orinflexible.

A prior art wireless tag includes a spiral antenna on a substrate and anelectronic device, typically an electronic chip or integrated circuit,connected to an antenna. Where the antenna has only one or two turns orloops, the electronic device may be mounted directly over and straddlingthe antenna because the distance between the contacts of the electronicdevice is greater than the distance between the terminals of theantenna. An example thereof is illustrated in FIGS. 15–16 of U.S. Pat.No. 6,404,643 issued Jun. 11, 2002, to Kevin Kwong-Tai Chung.

In a more common example, however, owing to a larger number of turns orloops of the spiral antenna and/or of the width and spacing thereof, thedistance between the antenna terminals is substantially greater than isthe spacing of the contacts of the electronic device. Connection acrossantenna 20 may be a conductor on the opposite side of substrate 12, asillustrated, for example, in FIGS. 2, 3A–3B and 6–8 of U.S. Pat. No.6,353,420 issued Mar. 5, 2002, to Kevin Kwong-Tai Chung.

For many “high-volume” or “high-quantity” utilizations, however, such asproduct tags, inventory tags, anti-theft tags, laundry tags, baggagetags and the like, the tags may be used only one or two times beforebeing discarded. The tags described in the aforementioned U.S. patentsare very suitable for such utilizations, but are usually much moredurable and robust than is necessary for single-use tags. Other priorart tags tend to employ multiply-layered substrates, complicatedconnection and interconnection arrangements, and the like, which tend tomake them too expensive for use in a tag that is disposed of after onlyone or two uses.

The cost of the identification tag could be reduced if a thinner, moreflexible and inexpensive substrate were to be used. One significantproblem associated with a thinner, more flexible substrate material isthat it lacks the “dimensional stability” of the thicker higher-costsubstrate materials and tends to curl and ripple rather than remainingplanar or “flat” as do stiffer substrates. As a result, it becomes verydifficult to place and solder electronic devices on such thin, flexiblesubstrate materials with sufficient accuracy of contact registration toconsistently produce acceptable identification devices, even when highlyaccurate “pick-and-place” automated assembly equipment is utilized. Thisproblem becomes worse when making tags having different sizes andconfigurations, particularly smaller tags.

Accordingly, an electronic circuit arrangement for an identification tagemploying a thin, flexible substrate would be desirable. In addition, itwould be desirable that such arrangement could utilize automatedassembly, and yet could still be of sufficiently low cost as to bedisposable.

To this end, the method of the present invention for making anelectronic article comprises

providing an insulating substrate having an electrical conductor thereonincluding first and second contact sites spaced apart substantially apredetermined distance;

providing an insulating electronic circuit substrate having a lengthsubstantially the predetermined distance, having first and secondcontact sites substantially at first and second ends thereof, and havingfirst and second terminals respectively connected to the first andsecond contact sites thereof;

mounting an electronic device to the electronic circuit substrate withfirst and second contacts of the electronic device connected to thefirst and second terminals of the electronic circuit substrate; and

then mounting the electronic circuit substrate to the insulatingsubstrate with the first and second contact sites of the substrateelectrically connecting with the first and second contact sites of theelectronic circuit substrate.

BRIEF DESCRIPTION OF THE DRAWING

The detailed description of the preferred embodiments of the presentinvention will be more easily and better understood when read inconjunction with the FIGURES of the Drawing which include:

FIG. 1 is a plan view of an RF tag employing an electronic device and anelectrical jumper;

FIGS. 2A, 2B and 2C are plan views of three example embodiments of acircuit arrangement each including an electronic device on an electroniccircuit jumper;

FIGS. 3 and 4 are a plan view and a side cross-sectional view,respectively, of an example embodiment of the electronic circuit jumperof FIGS. 2A–2C;

FIGS. 5 and 6 are cross-sectional views of alternative example mountingarrangements of the electronic circuit jumper of FIGS. 3 and 4 on thecircuit arrangements of FIGS. 2A–2C;

FIGS. 7A, 7B and 7C are cross-sectional views illustrating steps in themaking of the electronic circuit arrangement of FIGS. 3–4; and

FIG. 8 is a cross-sectional view illustrating a step in the making ofthe circuit arrangement of FIGS. 2A–2C, 5 and/or 6.

In the Drawing, where an element or feature is shown in more than onedrawing figure, the same alphanumeric designation may be used todesignate such element or feature in each figure, and where a closelyrelated or modified element is shown in a figure, the samealphanumerical designation primed may be used to designate the modifiedelement or feature. It is noted that, according to common practice, thevarious features of the drawing are not to scale, and the dimensions ofthe various features may be arbitrarily expanded or reduced for clarity.

DESCRIPTION OF THE PREFERRED EMBODIMENT(S)

FIG. 1 shows an example of an RP wireless tag 10. Tag 10 includes aspiral antenna 20 on a substrate 12 having antenna terminals 22.Terminals 52 of electronic device 50, typically an electronic chip orintegrated circuit 50, are too close together to be connected toterminals 22 of antenna 20. To connect across the turns of antenna 20,an electrical “jumper” conductor 40 is utilized. Jumper 40 includes adimensionally-stable substrate having an electrical conductor thereonand is on the same side of substrate 12 as is antenna 20, as shown inFIG. 1, and that connects a contact 24 to one antenna terminal 22.Contacts 52 of electronic device 50 are respectively connected toconductor 24 and to another of antenna terminals 22.

FIGS. 2A, 2B and 2C are plan views of three example embodiments 200S,200M and 200L of an electronic circuit arrangement each including anelectronic device 150 on an electronic circuit jumper 100 (also referredto herein as electronic circuit 100). In general, articles 200S, 200M,200L comprise a set of articles of different sizes and/or shapes whereineach article includes an electronic circuit 100 of the same size, andwherein each electronic circuit 100 includes an electronic device 150.The number of articles that comprise the set may be any number, e.g.,two or greater, and the number of different sizes and/or shapes of thearticles in a set may be any number, e.g., one or greater. For example,the set of articles illustrated by FIGS. 2A–2C includes three differentarticles representing three different sizes and shapes. In general, theelectronic circuits 100 of each of the articles of a set of articles arethe same length, i.e. their longer dimension is the same predetermineddistance D between the opposite ends of circuit 100.

In general, the illustrated articles 200S, 200M, 200L comprise wirelessarticles each including an antenna 220 operatively coupled to anelectronic device 150, as might be employed in a smart tag or card,credit or debit card, identification badge or tag, and/or other wirelessarticle, that may be utilized in any one or more environments, such as,for example, financial, commercial and/or other business transactions,article identification and/or tracking, personnel tracking and/oridentification, access control, registration, voting, security,inventory, and the like.

In particular, article 200S comprises a relatively smaller-size wirelessarticle 200S having a relatively smaller size substrate 210S on asurface of which is a relatively smaller size spiral antenna 220S havingterminals 222 and having a number of turns or loops 224. Terminals 222are spaced apart a predetermined distance D, typically with turns ofantenna 220 lying therebetween. A standard size electronic circuit 100is mounted to substrate 210S, specifically by a solder orelectrically-conductive adhesive connection 230 to terminals 222 ofantenna 220S. Electronic circuit 100 includes electronic device 150which is operatively connected to the opposing ends of electroniccircuit 100 whereat connections are made to antenna 220S via solder orconductive adhesive 230.

Similarly, article 200M comprises a relatively medium-size wirelessarticle 200M having a relatively medium size substrate 210M on a surfaceof which is a relatively medium size spiral antenna 220M havingterminals 222 and having a number of turns or loops 224. Terminals 222are spaced apart the predetermined distance D, typically with turns ofantenna 220 lying therebetween. The standard size electronic circuit 100is mounted to substrate 210M, specifically by solder orelectrically-conductive adhesive 230 to terminals 222 of antenna 220M.Electronic circuit 100 includes electronic device 150 which isoperatively connected to the opposing ends of electronic circuit 100whereat connections are made to antenna 220M via solder or conductiveadhesive 230.

Also similarly, article 200L comprises a relatively larger-size wirelessarticle 200S having a relatively larger size substrate 210L on a surfaceof which is a relatively larger size spiral antenna 220L havingterminals 222 and having a number of turns or loops 224. Terminals 222are spaced apart the predetermined distance D, typically with turns ofantenna 220 lying therebetween. The standard size electronic circuit 100is mounted to substrate 210L, specifically by solder orelectrically-conductive adhesive 230 to terminals 222 of antenna 220L.Electronic circuit 100 includes electronic device 150 which isoperatively connected to the opposing ends of electronic circuit 100whereat connections are made to antenna 220L via solder or conductiveadhesive 230.

Preferably, all of electronic circuits 100 are the same length, i.e. thedistance between the respective opposing ends thereof that connect toterminals 222 of antenna 220 (e.g., to antenna 220S, 220M and/or 220L),which length is the predetermined distance D. Preferably, the pair ofterminals 222 of each substrate 200 (e.g., substrate 200S, 200M and/or200L) are “spaced apart by a predetermined distance” D so that the endsof electronic circuit 100 will always be connectable thereto, e.g., bysolder or conductive adhesive. Thus, the spacing between pairs ofterminals 222 and the size of terminals 222 are such that, with thetolerances of the size and positioning of terminals 222, the ends ofstandard electronic circuit 100 will be connectable thereto. I.e. whenone end of a standard electronic circuit 100 is placed in any locationon a terminal 222, the other end thereof will be somewhere on thecorresponding terminal 222 so that connection may be made thereto.

To this end, it is preferred that electronic circuit 100 include asubstrate of a dimensionally stable material, irrespective of whether ornot substrate 210 is a dimensionally stable material. Thus, an advantageobtains if substrate 210 is a thin, flexible, elastic and/or low costmaterial that does not have sufficient dimensional stability to allow anelectronic device 150 having relatively small contacts 152 to beattached to corresponding contacts thereon reliably and consistently byautomated pick-and-place equipment. Because the substrate of electroniccircuit 100 is of a dimensionally stable material, an electronic device150 may be properly placed thereon and the relatively smaller contactsof electronic device 150 may be properly connected thereto, such as bysoldering, using automated pick-and-place equipment. Then electroniccircuit 100 may also be properly placed on and connected to relativelylarger contact sites on substrate 210 using automated pick-and-placeequipment even though the positions and dimensions of the contact sitesof substrate 210 may have a greater dimensional tolerance.

As used herein, a material is said to have “dimensional stability” or tobe a “dimensionally stable material” if it or a substantial component ofit has a glass transition temperature T_(g) that is higher than thetemperature to which it must be raised in processes utilized in makingthe circuit arrangement described herein. If the T_(g) of a material isgreater than the processing temperature, the material does not soften ormelt during the processing and so it will retain its shape and size. Ifthe material softens or melts, then the locations of features thereonmay move by an amount that is too great to maintain the tolerancesrequired by the process or the material may ripple, distort or otherwiselose planarity.

For example, where a material undergoes a soldering operation it must bedimensionally stable during soldering, so that the locations of sites tobe soldered maintain their locations to within a tolerance that iscompatible with the size of the sites and the item to be solderedthereto. In soldering, the material is raised to a temperature that ishigher than the melting temperature of solder, i.e. to greater thanabout 220° C. for a typical solder (although various types of soldersmay have higher or lower melting temperatures, e.g., in the range ofabout 200–250° C.). Where electronic devices are reflow soldered to anelectronic substrate or circuit board, the temperature is raised toabout 220–250° C. in order to melt and reflow the solder. Becausetypical electronic devices such as integrated circuit chips have contactpads that are only a few thousandths of an inch in size, the contactsites to which they are soldered must be located to within a fewthousandths of an inch. One one-thousandth of an inch is also known asone mil.

A material that undergoes a soldering operation will be dimensionallystable at the melting temperature of solder if, for example, its T_(g)is greater than about 250° C. One example of such dimensionally stablematerial is polyimide which has a T_(g) of about 350° C. A material thatundergoes a soldering operation will also be dimensionally stable at themelting temperature of solder if, for example, the T_(g) of asubstantial component thereof is greater than about 250° C. One exampleof such dimensionally stable material is FR4 fiberglass reinforced epoxywhich includes reinforcing glass fibers that have a T_(g) in excess ofabout 800° C.

When electronic devices are to be placed onto a substrate bypick-and-place equipment and soldered to the substrate, the contactsites thereon must be in known positions to within a tolerance about 2–3mils, even for a relatively large substrate, e.g., a substrate that is6×6 inches or 12×12 inches in size. Polyimide, FR4 fiberglass reinforcedepoxy, and liquid crystal polymer materials are examples of electronicsubstrate materials that can maintain such tolerances in solderingprocesses. Positional changes of contact sites on a substrate of amaterial that is not dimensionally stable may change by as much as 10–20mils, which is greater than the size of the contact pads of theelectronic devices. As a result, the electronic devices will beimproperly placed on the substrate and will yield inoperable or rejectproduct.

FIGS. 3 and 4 are a plan view and a side cross-sectional view of anexample embodiment of the electronic circuit jumper 100 of FIGS. 2A–2C.Electronic circuit 100 comprises a substrate 110 preferably of adimensionally stable material such as polyimide, of predetermined lengthD. A conductor layer on substrate 110 is patterned, e.g., a copper layerpatterned by etching, to define conductors 120 each extending from anopposing end of substrate 110 toward the central region thereof todefine a space or gap 124. Solder 130 is on an area of each conductor120 at each end of substrate 110. Solder 132 on an area at the end ofeach conductor 120 proximate gap 124 is reflowed to electrically connectcontacts 152 of electronic device 150 to conductors 120.

Electronic device may be an integrated circuit, semiconductor chip, flipchip device, surface-mount device, diode(s), transistor(s), or any otherelectronic device or component. The areas of solder 130, 132 are sizedto be sufficient for making reliable electrical connections asdescribed, and the gap 124 between conductors 120 is sized to be lessthan the spacing between contacts 152 of electronic device 150.

An example electronic circuit 100 includes a substrate 110 of polyimidethat is 0.10 inch wide and 0.40 inch in length, and is one mil thick.Substrate 110 is typically in the range of ½ to 2-mils thick. Conductors120 thereof are 0.08 inch wide by 0.19 inch in length, thereby to definea gap 124 of 0.02 inch. Conductors 120 are “one-ounce copper” which isabout 1.4 mils thick, but may be of “½-ounce copper” which is about 0.7mil thick, or may be of any other suitable conductor material andthickness. A suitable copper-clad polyimides include KAPTON® polyimideand PYRALUX® polyimide available from E.I. duPont de Nemoirs andCompany, located in Wilmington, Del.

Solder 130 and 132 are preferably screen printed solder paste of about0.07 by 0.04 inch size, such as the types R562 and EasyProfile™ 256“no-clean” solder pastes available from Kester Solder Company located inDes Plaines, Ill., and the types NC559AS and “Syntech” “no-clean” soldercreams available from Amtech Advanced SMP Solder Products located inBranford, Conn., and are reflowed when electronic device 150 is attachedto substrate 110.

Electronic circuit 100 may include an optional insulating cover layer140, such as of type CB7130 or type CB7160 thermoplastic adhesive, or oftype MEE7650 thermosetting adhesive, or of type UVA3150 ultravioletcuring adhesive, all of which are available from AI Technology, Inc.,located in Princeton Junction, N.J. Optional insulating layer 140 may beapplied by any suitable method, such as by screen printing, otherprinting, mask deposition, roll coating, sheet laminating, and the like.

FIGS. 5 and 6 are cross-sectional views of alternative example mountingarrangements of the electronic circuit jumper 100 of FIGS. 3 and 4. InFIG. 5, electronic circuit jumper 100 spans turns 124 of antenna 220 onsubstrate 210 of wireless article 200 to connect to terminals 222 ofantenna 220 with electronic device 150 on the side (surface) of jumper100 facing away from substrate 210. Electronic circuit 100 is placedwith its ends into solder paste 230 on terminals 222. When heat isapplied, solder 230 on terminals 222 of substrate 210 and solder 130 onconductors 120 of jumper 100 reflow to make electrical connectionbetween conductors 120 of jumper 100 and terminals 222 of antenna 220.

In FIG. 6, electronic circuit jumper 100 spans turns 124 of antenna 220on substrate 210 of wireless article 200 to connect to terminals 222 ofantenna 220 with electronic device 150 on the side (surface) of jumper100 facing towards substrate 210. Electronic circuit 100 is placed withsolder 130 at its ends against solder paste 230 on terminals 222. Whenheat is applied, solder 230 on terminals 222 of substrate 210 and solder130 on conductors 120 of jumper 100 reflow to make electrical connectionbetween conductors 120 of jumper 100 and terminals 222 of antenna 220.

Optionally, a covering layer 240 of insulating material may be appliedover substrate 210 and electronic circuit 100, e.g., employing any ofthe materials and methods described above in relation to layer 140 ofcircuit 100. Substrate 210 may be of any insulating material suitablefor an electronic substrate, such as polyimide, FR4 and liquid crystalpolymers. Typically, substrate 210 may be about 1–10 mils thick. Onesuitable substrate material is type ESP7450 flexible thermosettingadhesive available from AI Technology, which is preferred for a thin,e.g., 3-mil thick, flexible substrate that can be made at low cost. AnESP7450 substrate is not dimensionally stable for soldering operations,and so an electronic circuit 100 having a polyimide substrate 110 istypically utilized therewith.

FIGS. 7A–7C are cross-sectional views illustrating steps in the makingof the circuit arrangement 100 of FIGS. 3–4, and in particular, making aplurality of electronic circuits 100 from a sheet of substrate material110.

In FIG. 7A, a sheet of an electrical jumper substrate material 110′preferably of a dimensionally stable insulating material, such asone-mil thick polyimide, is provided with a conductor layer 120′thereon, such as one-ounce copper. The conductor layer is patterned,such as by conventional copper etching process, to provide a pluralityof elongated conductors 120′ thereon. The pitch of the elongatedconductors 120′ is a predetermined distance wherein “D” designates thepredetermined distance. The substrate 110 material may be a sheet, forexample a 12-inch by 12-inch sheet, or may be a roll of substratematerial 12-inches wide. Typically, the 12-inch wide substrate material110′ will permit about 26–27 patterns that will produce an electroniccircuit 100 of 0.4-inch length to be made across the width thereof. Each6-inch length of substrate material 110′ typically will permit about58–60 patterns of electronic circuit 100 of 0.1-inch width to be madetherefrom.

In FIG. 7B, a pattern of solder paste 130′ and 132 is deposited on eachof the elongated conductors 120′, wherein the pattern of solder pasteincludes at least areas of solder paste 132 at opposite distal ends ofeach elongated conductor 120′ and an area of solder paste 130′ centralto each elongated conductor 120′. Typically, each area of solder paste130′ is 0.07 inch by 0.08 inch and each area of solder paste 132 is 0.07inch by 0.04 inch, and both are typically about 2–10 mils thick, andpreferably about 4–6 mils thick The terms “solder paste” and “soldercream” are names for solder-containing products that can be applied invarious ways such as by screen printing, mask deposition, printing,blade-spreading, and the like.

In FIG. 7C, a plurality of electronic devices 150 are placed on theelectrical jumper substrate 110′ with first and second contacts 152 ofeach electronic device 150 abutting the pattern of solder paste 132 atadjacent distal ends of adjacent ones of the plurality of elongatedconductors 120′. The solder paste 130′, 132 is processed to electricallyconnect the first and second contacts 152 of each electronic device 150to the adjacent elongated conductors 120′ of the electrical jumpersubstrate 110′. Processing the solder paste 130′, 132 includes heatingat least solder paste 132 to at least the melting temperature of thesolder so that solder paste 132 flows to form electrical connections ofcontacts 152 and conductors 120′, however, solder paste 130′ may also beheated and reflow on conductors 120′.

Also in FIG. 7C, but following attachment of electronic devices 150 asdescribed, the electronic jumper substrate 110′ is separated intoindividual jumpers 100, including dividing each elongated conductor 120′at the central area of solder 130′ thereon. Preferably, the separationis performed by die cutting represented by cutting die 160 spaced apartby the predetermined distance “D” to divide substrate 110′, conductor120′ and solder 130′ substantially at the center of conductor 120′ andsolder 130′. As a result, each individual jumper 100 includes first andsecond elongated conductor 120 portions and one electronic device 150having first and second contacts 152 respectively connected to first andsecond conductor portions 120, as shown in FIG. 4. Further, the dividedcentral solder 130 area of the first and second electrical conductorportions 120 of each individual jumper 100 are adjacent respective edgesof the individual jumper 100, and each individual jumper 100 has onedimension that is substantially the predetermined distance “D.”

Also preferably, the die-cutting die 160 employed to separate substrate110′ into individual articles 100 is directed into the solder 130 sideof substrate 110 and conductors 120 so that the cut edge thereof willtend to have the solder 130 deformed over a deformed conductor 120 andsubstrate 110. This tends to facilitate soldering to terminals 222 ofconductor pattern 220, particularly when jumper 100 is mounted in thearrangement shown in FIG. 5.

FIG. 8 is a cross-sectional view illustrating a step in the making ofthe circuit arrangement 200 of FIGS. 2A–2C, 5 and/or 6. An insulatingsubstrate 210 is provided having an electrical conductor pattern 220thereon. Solder paste 230′ is applied on the terminals 222 of theconductor pattern 220, preferably of a thickness at least as great asthe combined thicknesses of substrate 110 and conductor 120 ofelectronic circuit 100. An individual circuit jumper 100 is then mountedto an insulating substrate 210 with the divided central solder 130 areasof the first and second elongated conductor portions 120 of theindividual jumper 100 electrically connecting with first and secondcontact sites 222 of one electrical conductor pattern of the electronicsubstrate 210. Typically, solder 130 and solder 230 flow together whenthey are melted, as in a reflow soldering process.

Preferably, a plurality of articles 200 are produced substantiallycontemporaneously from an insulating substrate 210 on which are provideda plurality of conductor patterns 220 each having terminals 222.Typically a 12-inch wide insulating substrate material is provided, andit may be a sheet of convenient length, such as a 12-inch long sheet, ormay be a longer rolled sheet or strip. A 12-inch by 12-inch insulatingsubstrate can be utilized to provide, for example, an 11 by 12 array ofindividual substrates 210 of about 1 by 1 inch size, or a 7 by 8 arrayof individual substrates 210 of about 1.5 by 1.5 inch size, a 3 by 5array of individual substrates 210 of about 3.6 by 2.25 inch size. Onesuitable substrate material includes a 3-mil thick sheet of type ESP7450flexible insulating thermosetting adhesive also available from AITechnology, which adhesive sheet is flexible and stretchy, and so is notdimensionally stable for soldering electronic devices directly thereto.Typical substrates are in the range of about 1 to 10 mils thick.

Where a sheet of insulating substrate material 210 is utilized,following the mounting of an individual jumper to each conductivepattern thereon, the insulating substrate 210 is separated intoindividual electronic articles 200, wherein each individual electronicarticle 200 includes one conductor pattern 220 and one individual jumper100 connected thereto. Separating of the insulating substrate 210 intoindividual articles 200 may be by die cutting or any other convenientmethod.

The embodiments described generally employ solder for electricalconnections between the tag substrate 210 terminals 222 and conductors120, and between conductors 120 and contacts 152 of electronic device150, however, such connections could be made by an electricallyconductive adhesive. Such electrically-conductive adhesive could beapplied in a liquid form or in a solid form, for example, by screenprinting, mask deposition, preform transfer, lamination, or any othersuitable method.

Suitable electrically conductive adhesives include, for example, typeLTP8150 liquid flexible-thermoplastic conductive adhesive, type ESP8650flexible electrically-conductive thermosetting adhesive, types ESS8450(silver filler), ESS8456 (silver-palladium alloy filler), ESS8457(gold-plated copper filler), ESS8458 (gold powder filler) and ESS8459(gold-plated nickel filler) flexible epoxy-based adhesive pastes andtypes PSS8156 (silver-palladium alloy filler), PSS8157 (gold-platedcopper filler), PSS8158 (gold powder filler) and PSS8159 (gold-platednickel filler) flexible paste adhesives, all of which are commerciallyavailable from A1 Technology, Inc. of Princeton Junction, N.J., and typeCB025 electrically conductive ink available from E.I. dupont de Nemoirsand Company, located in Wilmington, Del. Processing theelectrically-conductive adhesive may include one or more of drying,B-staging, melt flowing, tacking, curing, heat curing, and the like.Preferably, the contacts to which electrically conductive adhesive isapplied are plated or otherwise coated with gold, platinum, silver,nickel, or other precious or noble metal that resists oxidation and/orcorrosion.

As used herein, the term “about” means that dimensions, sizes,formulations, parameters, shapes and other quantities andcharacteristics are not and need not be exact, but may be approximateand/or larger or smaller, as desired, reflecting tolerances, conversionfactors, rounding off, measurement error and the like, and other factorsknown to those of skill in the art. In general, a dimension, size,formulation, parameter, shape or other quantity or characteristic is“about” or “approximate” whether or not expressly stated to be such Theterms “electrical” substrate and “electronic” substrate are consideredto be interchangeable.

While the present invention has been described in terms of the foregoingexemplary embodiments, variations within the scope and spirit of thepresent invention as defined by the claims following will be apparent tothose skilled in the art. For example, while the examples of tagsubstrates 210 and of jumper substrates 110 are illustrated asrectangular, other shapes may be employed as is desired and as may beconvenient or necessary in a given utilization. Similarly, while theexamples of conductors 120, of contacts 130, 132, 222, and of theapplied solder/conductive adhesive areas 130, 132, 230 are illustratedas rectangular, they may be square or circular or of any desired shape.

Further, while the electronic device 150 is shown as connected atopposing ends of a gap in an electrical conductor 20, 120, two or morecontacts or a pattern of two or more contacts may be provided for makingtwo or more connections thereto.

1. A method for making an electronic article comprising: providing an insulating substrate for the electronic article having an electrical conductor thereon, wherein the insulating substrate is of a material that is not dimensionally stable, wherein the electrical conductor includes first and second contact sites spaced apart substantially a predetermined distance; providing an insulating electronic jumper substrate of a dimensionally stable material and having a length substantially the predetermined distance between first and second opposing ends, having first and second contact sites at the first and second opposing ends thereof, respectively, and having first and second terminals respectively connected to the first and second contact sites thereof; mounting an electronic device to the electronic jumper substrate with first and second contacts of the electronic device connected to the first and second terminals of the electronic jumper substrate; and then mounting the electronic jumper substrate to the insulating substrate with the first and second contact sites of the electronic jumper substrate electrically connecting with the first and second contact sites of the insulating substrate.
 2. The method of claim 1 further comprising, prior to said mounting an electronic device, applying solder or electrically conductive adhesive to the first and second terminals of the insulating electronic jumper substrate.
 3. The method of claim 2 wherein said mounting an electronic device includes heating the solder or electrically conductive adhesive to a melting temperature and placing the first and second contacts of the electronic device against the solder or electrically conductive adhesive.
 4. The method of claim 1 further comprising, prior to said mounting the electronic jumper substrate, applying solder or electrically conductive adhesive to the first and second contact sites of the insulating substrate and/or to the first and second contact sites of the electronic jumper substrate.
 5. The method of claim 4 wherein said mounting the electronic jumper substrate includes heating the solder or electrically conductive adhesive to a melting temperature and placing the first and second contact sites of the electronic jumper substrate against the solder or electrically conductive adhesive.
 6. The method of claim 5 wherein said providing an insulating electronic jumper substrate includes providing a substrate of a material that is dimensionally stable at the melting temperature.
 7. The method of claim 5 wherein said providing an insulating substrate includes providing a substrate of a material that is not dimensionally stable at the melting temperature.
 8. The method of claim 1 wherein said providing an insulating substrate comprises forming an elongated electrical conductor defining an antenna connected to the first and second contact sites.
 9. A method for making a plurality of electronic articles comprising: providing an insulating substrate having a plurality of electrical conductor patterns thereon, wherein each electrical conductor pattern includes first and second contact sites spaced apart substantially a predetermined distance; providing an electronic jumper substrate of a dimensionally stable insulating material having a plurality of sets of first and second condacts and first and second terminals thereon, wherein the first and second contacts of each set thereof are spaced apart substantially the predetermined distance; mounting a plurality of electronic devices to the electronic jumper substrate with first and second contacts of each electronic device connected to one set of first and second terminals of the electronic jumper substrate; separating the electronic jumper substrate into individual jumpers wherein each individual jumper includes one set of first and second terminals and one electronic device connected thereto, wherein the set of first and second contact sites of each individual jumper are adjacent respective edges of the individual jumper; then mounting individual jumpers to the insulating substrate with the first and second contact sites of the individual jumper electrically connecting with the first and second contact sites of one electrical conductor pattern of the electronic jumper substrate; and separating the insulating substrate into individual electronic articles, wherein each individual electronic article includes one conductor pattern and one individual jumper.
 10. The method of claim 9 further comprising, prior to said mounting a plurality of electronic devices, applying solder or electrically conductive adhesive to the first and second terminals of the electronic jumper substrate.
 11. The method of claim 10 wherein said mounting a plurality of electronic devices includes heating the solder or electrically conductive adhesive to a melting temperature and placing the first and second contacts of the plurality of electronic devices against the solder or electrically conductive adhesive.
 12. The method of claim 9 further comprising: prior to said separating the electronic jumper substrate, applying solder or electrically conductive adhesive to the first and second contact sites of the individual jumpers; and/or prior to said mounting individual jumpers, applying solder or electrically conductive adhesive to the first and second contact sites at the insulating substrate.
 13. The method of claim 12 wherein said mounting individual jumpers includes heating the solder or electrically conductive adhesive to a melting temperature and placing the first and second contact sites of the individual jumpers against the solder or electrically conductive adhesive.
 14. The method of claim 13 wherein said providing an insulating substrate includes providing a substrate of a material that is not dimensionally stable at the melting temperature.
 15. The method of claim 9 wherein said providing an insulating substrate comprises forming an elongated electrical conductor defining an antenna connected to the first and second contact sites.
 16. A method for making a plurality of electronic articles comprising: providing an insulating substrate of a material having a plurality of electrical conductor patterns thereon, wherein each electrical conductor pattern includes first and second contact sites spaced apart substantially a predetermined distance; providing an electronic jumper substrate of a dimensionally stable insulating material having a plurality of elongated conductors thereon, wherein the pitch of the elongated conductors is substantially the predetermined distance; applying a pattern of solder paste or electrically conductive adhesive on each of the elongated conductors, wherein the pattern of solder paste or electrically conductive adhesive includes at least areas at opposite distal ends of each elongated conductor and an area central to each elongated conductor; placing a plurality of electronic devices on the electronic jumper substrate with first and second contacts of each electronic device abutting the pattern of solder paste or electrically conductive adhesive at adjacent distal ends of adjacent ones of the plurality of elongated conductors; processing the solder paste or electrically conductive adhesive to electrically connect the first and second contacts of each electronic device to the adjacent elongated conductors of the electronic jumper substrate; separating the electronic jumper substrate into individual jumpers including dividing each elongated conductor and the central area of solder paste or electrically conductive adhesive thereon, wherein each individual jumper includes first and second elongated conductor portions and one electronic device having first and second contacts respectively connected thereto, wherein the divided central solder paste or electrically conductive adhesive area of the first and second elongated conductor portions of each individual jumper are adjacent respective edges of the individual jumper, and wherein each individual jumper has one dimension that is substantially the predetermined distance; then mounting individual jumpers to the insulating substrate with the divided central solder paste or electrically conductive adhesive areas of the first and second elongated conductor portions of the individual jumper electrically connecting with the first and second contact sites of one electrical conductor pattern of the insulating substrate; and separating the insulating substrate into individual electronic articles, wherein each individual electronic article includes one conductor pattern and one individual jumper connected thereto.
 17. The method of claim 16 wherein said processing includes heating the solder paste or electrically conductive adhesive to a melting temperature, and/or heating the electrically conductive adhesive to a curing temperature.
 18. The method of claim 16 wherein said mounting individual jumpers includes heating the solder paste or electrically conductive adhesive to a melting temperature, and/or heating the electrically conductive adhesive to a curing temperature.
 19. The method of claim 18 wherein said providing an insulating substrate includes providing a substrate of a material that is not dimensionally stable at the melting temperature.
 20. The method of claim 16 wherein said providing an insulating substrate comprises forming an elongated electrical conductor defining an antenna connected to the first and second contact sites.
 21. The method of claim 16 wherein said separating the electronic jumper substrate includes either die cutting the electronic jumper substrate or die cutting the electronic jumper substrate by a die contacting the central solder paste or electrically conductive adhesive area.
 22. A method for making a plurality of electronic circuits comprising: providing an electronic jumper substrate of a dimensionally stable insulating material having a plurality of elongated conductors thereon, wherein the pitch of the elongated conductors is a predetermined distance; applying a pattern of solder paste or electrically conductive adhesive on each of the elongated conductors, wherein the pattern of solder paste or electrically conductive adhesive includes at least areas at opposite distal ends of each elongated conductor and an area central to each elongated conductor; placing a plurality of electronic devices on the electronic jumper substrate with first and second contacts of each electronic device abutting the pattern of solder paste or electrically conductive adhesive at adjacent distal ends of adjacent ones of the plurality of elongated conductors; processing the solder paste or electrically conductive adhesive to electrically connect the first and second contacts of each electronic device to the adjacent elongated conductors of the electronic jumper substrate; separating the electronic jumper substrate into individual jumpers including dividing each elongated conductor at the central area of solder paste or electrically conductive adhesive thereon, wherein each individual jumper includes first and second elongated conductor portions and one electronic device having first and second contacts respectively connected thereto, wherein the divided central solder paste or electrically conductive adhesive area of the first and second electrical conductor portions of each individual jumper are adjacent respective edges of the individual jumper, and wherein each individual jumper has one dimension that is substantially the predetermined distance.
 23. The method of claim 22 wherein said processing includes heating the solder paste or electrically conductive adhesive to a melting temperature, and/or heating the electrically conductive adhesive to a curing temperature.
 24. The method of claim 22 wherein said separating the electronic jumper substrate includes either die cutting the electronic jumper substrate or die cutting the electronic jumper substrate by a die contacting the central solder paste or electrically conductive adhesive area.
 25. The method of claim 22 further comprising: providing an insulating substrate including an elongated electrical conductor defining an antenna connected to first and second contact sites; and connecting the divided central solder paste or electrically conductive adhesive areas of the individual jumper to the first and second contact sites of the insulating substrate. 